A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

K. H. Kang, H. B. Jeon, H. Park, S. Uozumi, K. Adamczyk, H. Aihara, C. Angelini, T. Aziz, V. Babu, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, A. K. Basith, G. Batignani, A. Bauer, P. K. Behera, T. Bergauer, S. Bettarini, B. BhuyanT. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Casarosa, M. Ceccanti, D. Červenkov, S. R. Chendvankar, N. Dash, S. T. Divekar, Z. Doležal, D. Dutta, F. Forti, M. Friedl, K. Hara, T. Higuchi, T. Horiguchi, C. Irmler, A. Ishikawa, C. W. Joo, J. Kandra, E. Kato, T. Kawasaki, P. Kodyš, T. Kohriki, S. Koike, M. M. Kolwalkar, P. Kvasnička, L. Lanceri, J. Lettenbicher, P. Mammini, S. N. Mayekar, G. B. Mohanty, S. Mohanty, T. Morii, K. R. Nakamura, Z. Natkaniec, K. Negishi, N. K. Nisar, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, F. Pilo, A. Profeti, K. K. Rao, I. Rashevskaia, G. Rizzo, M. Rozanska, S. Sandilya, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, Y. Seino, N. Shimizu, J. Stypula, S. Tanaka, K. Tanida, G. N. Taylor, R. Thalmeier, R. Thomas, T. Tsuboyama, P. Urquijo, L. Vitale, M. Volpi, S. Watanuki, I. J. Watson, J. Webb, J. Wiechczynski, S. Williams, B. Würkner, H. Yamamoto, H. Yin, T. Yoshinobu

Research output: Contribution to journalArticlepeer-review


A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

Original languageEnglish
Pages (from-to)213-220
Number of pages8
JournalNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Publication statusPublished - Sept 21 2016


  • Belle-II
  • DSSD
  • Origami
  • Pitch adapter
  • SVD
  • Wire bonding

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Instrumentation


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