A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

K. H. Kang; H. B. Jeon; H. Park; S. Uozumi; K. Adamczyk; H. Aihara; C. Angelini; T. Aziz; V. Babu; S. Bacher; S. Bahinipati; E. Barberio; T. Baroncelli; A. K. Basith; G. Batignani; A. Bauer; P. K. Behera; T. Bergauer; S. Bettarini; B. Bhuyan; T. Bilka; F. Bosi; L. Bosisio; A. Bozek; F. Buchsteiner; G. Casarosa; M. Ceccanti; D. Červenkov; S. R. Chendvankar; N. Dash; S. T. Divekar; Z. Doležal; D. Dutta; F. Forti; M. Friedl; K. Hara; T. Higuchi; T. Horiguchi; C. Irmler; A. Ishikawa; C. W. Joo; J. Kandra; E. Kato; T. Kawasaki; P. Kodyš; T. Kohriki; S. Koike; M. M. Kolwalkar; P. Kvasnička; L. Lanceri; J. Lettenbicher; P. Mammini; S. N. Mayekar; G. B. Mohanty; S. Mohanty; T. Morii; K. R. Nakamura; Z. Natkaniec; K. Negishi; N. K. Nisar; Y. Onuki; W. Ostrowicz; A. Paladino; E. Paoloni; F. Pilo; A. Profeti; K. K. Rao; I. Rashevskaia; G. Rizzo; M. Rozanska; S. Sandilya; J. Sasaki; N. Sato; S. Schultschik; C. Schwanda; Y. Seino; N. Shimizu; J. Stypula; S. Tanaka; K. Tanida; G. N. Taylor; R. Thalmeier; R. Thomas; T. Tsuboyama; P. Urquijo; L. Vitale; M. Volpi; S. Watanuki; I. J. Watson; J. Webb; J. Wiechczynski; S. Williams; B. Würkner; H. Yamamoto; H. Yin; T. Yoshinobu

doi:10.1016/j.nima.2016.03.075

A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

K. H. Kang, H. B. Jeon, H. Park, S. Uozumi, K. Adamczyk, H. Aihara, C. Angelini, T. Aziz, V. Babu, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, A. K. Basith, G. Batignani, A. Bauer, P. K. Behera, T. Bergauer, S. Bettarini, B. BhuyanT. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Casarosa, M. Ceccanti, D. Červenkov, S. R. Chendvankar, N. Dash, S. T. Divekar, Z. Doležal, D. Dutta, F. Forti, M. Friedl, K. Hara, T. Higuchi, T. Horiguchi, C. Irmler, A. Ishikawa, C. W. Joo, J. Kandra, E. Kato, T. Kawasaki, P. Kodyš, T. Kohriki, S. Koike, M. M. Kolwalkar, P. Kvasnička, L. Lanceri, J. Lettenbicher, P. Mammini, S. N. Mayekar, G. B. Mohanty, S. Mohanty, T. Morii, K. R. Nakamura, Z. Natkaniec, K. Negishi, N. K. Nisar, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, F. Pilo, A. Profeti, K. K. Rao, I. Rashevskaia, G. Rizzo, M. Rozanska, S. Sandilya, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, Y. Seino, N. Shimizu, J. Stypula, S. Tanaka, K. Tanida, G. N. Taylor, R. Thalmeier, R. Thomas, T. Tsuboyama, P. Urquijo, L. Vitale, M. Volpi, S. Watanuki, I. J. Watson, J. Webb, J. Wiechczynski, S. Williams, B. Würkner, H. Yamamoto, H. Yin, T. Yoshinobu

School of Science

Research output: Contribution to journal › Article › peer-review

Abstract

A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

Original language	English
Pages (from-to)	213-220
Number of pages	8
Journal	Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume	831
DOIs	https://doi.org/10.1016/j.nima.2016.03.075
Publication status	Published - Sept 21 2016

Keywords

Belle-II
DSSD
Origami
Pitch adapter
SVD
Wire bonding

ASJC Scopus subject areas

Nuclear and High Energy Physics
Instrumentation

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10.1016/j.nima.2016.03.075

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Kang, K. H., Jeon, H. B., Park, H., Uozumi, S., Adamczyk, K., Aihara, H., Angelini, C., Aziz, T., Babu, V., Bacher, S., Bahinipati, S., Barberio, E., Baroncelli, T., Basith, A. K., Batignani, G., Bauer, A., Behera, P. K., Bergauer, T., Bettarini, S., ... Yoshinobu, T. (2016). A bonding study toward the quality assurance of Belle-II silicon vertex detector modules. Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 831, 213-220. https://doi.org/10.1016/j.nima.2016.03.075

Kang, KH, Jeon, HB, Park, H, Uozumi, S, Adamczyk, K, Aihara, H, Angelini, C, Aziz, T, Babu, V, Bacher, S, Bahinipati, S, Barberio, E, Baroncelli, T, Basith, AK, Batignani, G, Bauer, A, Behera, PK, Bergauer, T, Bettarini, S, Bhuyan, B, Bilka, T, Bosi, F, Bosisio, L, Bozek, A, Buchsteiner, F, Casarosa, G, Ceccanti, M, Červenkov, D, Chendvankar, SR, Dash, N, Divekar, ST, Doležal, Z, Dutta, D, Forti, F, Friedl, M, Hara, K, Higuchi, T, Horiguchi, T, Irmler, C, Ishikawa, A, Joo, CW, Kandra, J, Kato, E, Kawasaki, T, Kodyš, P, Kohriki, T, Koike, S, Kolwalkar, MM, Kvasnička, P, Lanceri, L, Lettenbicher, J, Mammini, P, Mayekar, SN, Mohanty, GB, Mohanty, S, Morii, T, Nakamura, KR, Natkaniec, Z, Negishi, K, Nisar, NK, Onuki, Y, Ostrowicz, W, Paladino, A, Paoloni, E, Pilo, F, Profeti, A, Rao, KK, Rashevskaia, I, Rizzo, G, Rozanska, M, Sandilya, S, Sasaki, J, Sato, N, Schultschik, S, Schwanda, C, Seino, Y, Shimizu, N, Stypula, J, Tanaka, S, Tanida, K, Taylor, GN, Thalmeier, R, Thomas, R, Tsuboyama, T, Urquijo, P, Vitale, L, Volpi, M, Watanuki, S, Watson, IJ, Webb, J, Wiechczynski, J, Williams, S, Würkner, B, Yamamoto, H, Yin, H & Yoshinobu, T 2016, 'A bonding study toward the quality assurance of Belle-II silicon vertex detector modules', Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 831, pp. 213-220. https://doi.org/10.1016/j.nima.2016.03.075

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title = "A bonding study toward the quality assurance of Belle-II silicon vertex detector modules",

abstract = "A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.",

keywords = "Belle-II, DSSD, Origami, Pitch adapter, SVD, Wire bonding",

author = "Kang, {K. H.} and Jeon, {H. B.} and H. Park and S. Uozumi and K. Adamczyk and H. Aihara and C. Angelini and T. Aziz and V. Babu and S. Bacher and S. Bahinipati and E. Barberio and T. Baroncelli and Basith, {A. K.} and G. Batignani and A. Bauer and Behera, {P. K.} and T. Bergauer and S. Bettarini and B. Bhuyan and T. Bilka and F. Bosi and L. Bosisio and A. Bozek and F. Buchsteiner and G. Casarosa and M. Ceccanti and D. {\v C}ervenkov and Chendvankar, {S. R.} and N. Dash and Divekar, {S. T.} and Z. Dole{\v z}al and D. Dutta and F. Forti and M. Friedl and K. Hara and T. Higuchi and T. Horiguchi and C. Irmler and A. Ishikawa and Joo, {C. W.} and J. Kandra and E. Kato and T. Kawasaki and P. Kody{\v s} and T. Kohriki and S. Koike and Kolwalkar, {M. M.} and P. Kvasni{\v c}ka and L. Lanceri and J. Lettenbicher and P. Mammini and Mayekar, {S. N.} and Mohanty, {G. B.} and S. Mohanty and T. Morii and Nakamura, {K. R.} and Z. Natkaniec and K. Negishi and Nisar, {N. K.} and Y. Onuki and W. Ostrowicz and A. Paladino and E. Paoloni and F. Pilo and A. Profeti and Rao, {K. K.} and I. Rashevskaia and G. Rizzo and M. Rozanska and S. Sandilya and J. Sasaki and N. Sato and S. Schultschik and C. Schwanda and Y. Seino and N. Shimizu and J. Stypula and S. Tanaka and K. Tanida and Taylor, {G. N.} and R. Thalmeier and R. Thomas and T. Tsuboyama and P. Urquijo and L. Vitale and M. Volpi and S. Watanuki and Watson, {I. J.} and J. Webb and J. Wiechczynski and S. Williams and B. W{\"u}rkner and H. Yamamoto and H. Yin and T. Yoshinobu",

note = "Funding Information: This research was supported by the National Research Foundation of Korea (NRF) Grants No. 2014R1A2A2A01002734 funded by the Ministry of Education, Science and Technology and by the Global PH.D. Fellowship Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No. 2015H1A2A1033649 ). Publisher Copyright: {\textcopyright} 2016 Elsevier B.V.",

year = "2016",

month = sep,

day = "21",

doi = "10.1016/j.nima.2016.03.075",

language = "English",

volume = "831",

pages = "213--220",

journal = "Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment",

issn = "0168-9002",

publisher = "Elsevier",

}

TY - JOUR

T1 - A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

AU - Kang, K. H.

AU - Jeon, H. B.

AU - Park, H.

AU - Uozumi, S.

AU - Adamczyk, K.

AU - Aihara, H.

AU - Angelini, C.

AU - Aziz, T.

AU - Babu, V.

AU - Bacher, S.

AU - Bahinipati, S.

AU - Barberio, E.

AU - Baroncelli, T.

AU - Basith, A. K.

AU - Batignani, G.

AU - Bauer, A.

AU - Behera, P. K.

AU - Bergauer, T.

AU - Bettarini, S.

AU - Bhuyan, B.

AU - Bilka, T.

AU - Bosi, F.

AU - Bosisio, L.

AU - Bozek, A.

AU - Buchsteiner, F.

AU - Casarosa, G.

AU - Ceccanti, M.

AU - Červenkov, D.

AU - Chendvankar, S. R.

AU - Dash, N.

AU - Divekar, S. T.

AU - Doležal, Z.

AU - Dutta, D.

AU - Forti, F.

AU - Friedl, M.

AU - Hara, K.

AU - Higuchi, T.

AU - Horiguchi, T.

AU - Irmler, C.

AU - Ishikawa, A.

AU - Joo, C. W.

AU - Kandra, J.

AU - Kato, E.

AU - Kawasaki, T.

AU - Kodyš, P.

AU - Kohriki, T.

AU - Koike, S.

AU - Kolwalkar, M. M.

AU - Kvasnička, P.

AU - Lanceri, L.

AU - Lettenbicher, J.

AU - Mammini, P.

AU - Mayekar, S. N.

AU - Mohanty, G. B.

AU - Mohanty, S.

AU - Morii, T.

AU - Nakamura, K. R.

AU - Natkaniec, Z.

AU - Negishi, K.

AU - Nisar, N. K.

AU - Onuki, Y.

AU - Ostrowicz, W.

AU - Paladino, A.

AU - Paoloni, E.

AU - Pilo, F.

AU - Profeti, A.

AU - Rao, K. K.

AU - Rashevskaia, I.

AU - Rizzo, G.

AU - Rozanska, M.

AU - Sandilya, S.

AU - Sasaki, J.

AU - Sato, N.

AU - Schultschik, S.

AU - Schwanda, C.

AU - Seino, Y.

AU - Shimizu, N.

AU - Stypula, J.

AU - Tanaka, S.

AU - Tanida, K.

AU - Taylor, G. N.

AU - Thalmeier, R.

AU - Thomas, R.

AU - Tsuboyama, T.

AU - Urquijo, P.

AU - Vitale, L.

AU - Volpi, M.

AU - Watanuki, S.

AU - Watson, I. J.

AU - Webb, J.

AU - Wiechczynski, J.

AU - Williams, S.

AU - Würkner, B.

AU - Yamamoto, H.

AU - Yin, H.

AU - Yoshinobu, T.

N1 - Funding Information: This research was supported by the National Research Foundation of Korea (NRF) Grants No. 2014R1A2A2A01002734 funded by the Ministry of Education, Science and Technology and by the Global PH.D. Fellowship Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No. 2015H1A2A1033649 ). Publisher Copyright: © 2016 Elsevier B.V.

PY - 2016/9/21

Y1 - 2016/9/21

N2 - A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

AB - A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor “Origami” method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

KW - Belle-II

KW - DSSD

KW - Origami

KW - Pitch adapter

KW - SVD

KW - Wire bonding

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UR - http://www.scopus.com/inward/citedby.url?scp=84961904329&partnerID=8YFLogxK

U2 - 10.1016/j.nima.2016.03.075

DO - 10.1016/j.nima.2016.03.075

M3 - Article

AN - SCOPUS:84961904329

SN - 0168-9002

VL - 831

SP - 213

EP - 220

JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

ER -

A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

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