Codeposition of α-Alumina Particles from Acid Copper Sulfate Bath

Hidetaka Hayashi, Shin Ya Izumi, Isao Tari

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)


The purpose of this work is to elucidate the factors affecting the codeposition of a-alumina particles with copper from an acid copper sulfate bath. The effect of current density and particle concentration in the bath on the amount of codeposited a-alumina were determined. In order to evaluate the surface-chemical properties of the particles, the zeta-potential of a-alumina particles in the plating bath was determined by means of the streaming potential method. The amounts of adsorbed Cu2+ and SO2- from the plating bath were also determined. The amount of codeposited a-alumina particles was found to be greater than those reported in literature, in spite of the negative zeta-potential values of α-alumina. This indicates that the electrostatic interaction between the particles and the cathode is not the essential factor of the codeposition process. It is considered that the amount of adsorbed Cu2+ on thea-αlumina particle plays an important role in the codeposition behavior.

Original languageEnglish
Pages (from-to)362-365
Number of pages4
JournalJournal of the Electrochemical Society
Issue number2
Publication statusPublished - 1993
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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