TY - JOUR
T1 - Cutting Mechanism of Sialon with a Single Point Diamond
AU - Nakajima, Toshikatsu
AU - Uno, Yoshiyuki
AU - Fujiwara, Takanori
AU - Ikejiri, Atsunori
N1 - Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 1987
Y1 - 1987
N2 - The circular cutting with a single point diamond cutting edge, in which the depth of cut is very small and takes maximum at some point, is carried out for making clear a cutting process of sialon under conditions similar to practical grinding, investigating sliding of a diamond on sialon, chip formation, groove profile, stock removal and so on. Main conclusions obtained in this study are as follows: (1) There are three different regions with depth of cut; elastic, plastic and cutting region. (2) In the transitional cutting process, there are following three types of interference with maximum depth of cut; (i) elastic region through the contact length, (ii) elastic — plastic — elastic, (iii) elastic — plastic — cutting — plastic — elastic. (3) Chips are formed by plastic deformation as well as brittle fracture. (4) Cracks generated under real interference groove become larger with increases of depth of cut and nose radius of cutting edge.
AB - The circular cutting with a single point diamond cutting edge, in which the depth of cut is very small and takes maximum at some point, is carried out for making clear a cutting process of sialon under conditions similar to practical grinding, investigating sliding of a diamond on sialon, chip formation, groove profile, stock removal and so on. Main conclusions obtained in this study are as follows: (1) There are three different regions with depth of cut; elastic, plastic and cutting region. (2) In the transitional cutting process, there are following three types of interference with maximum depth of cut; (i) elastic region through the contact length, (ii) elastic — plastic — elastic, (iii) elastic — plastic — cutting — plastic — elastic. (3) Chips are formed by plastic deformation as well as brittle fracture. (4) Cracks generated under real interference groove become larger with increases of depth of cut and nose radius of cutting edge.
KW - chip
KW - circular cutting
KW - cutting region
KW - elastic region
KW - groove profile
KW - normally sintered sialon
KW - plastic deformation
KW - single point diamond
KW - transitional cutting process
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U2 - 10.2493/jjspe.53.1271
DO - 10.2493/jjspe.53.1271
M3 - Article
AN - SCOPUS:85008035987
SN - 0912-0289
VL - 53
SP - 1271
EP - 1276
JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
IS - 8
ER -