TY - GEN
T1 - Design of Non-Reciprocal Lamb Wave Filter by Heterojunction Phononic Crystals
AU - Tsuruta, Kenji
AU - Asada, Shota
AU - Iwasaki, Yuhei
AU - Ishikawa, Atsushi
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12/17
Y1 - 2018/12/17
N2 - We designed a new acoustic diode model, based on a one-dimensional structure consisting of piezoelectric ceramic films placed periodically in an epoxy plate. Specifically, the model is designed to exhibit non-reciprocal wave propagation in the audible and ultrasonic range. Our model includes no artificial forces to generate the asymmetry in the system but utilizes a mode-conversion mechanisms of elastic-wave propagation at interfaces. We demonstrate numerically that the model can achieve non-reciprocity at a particular frequency range for both S-mode and A-mode incidence of the Lamb wave. We further attempt to develop an additional model that can suppress unwanted backward propagation due to a large mismatch at the heterojunction interface.
AB - We designed a new acoustic diode model, based on a one-dimensional structure consisting of piezoelectric ceramic films placed periodically in an epoxy plate. Specifically, the model is designed to exhibit non-reciprocal wave propagation in the audible and ultrasonic range. Our model includes no artificial forces to generate the asymmetry in the system but utilizes a mode-conversion mechanisms of elastic-wave propagation at interfaces. We demonstrate numerically that the model can achieve non-reciprocity at a particular frequency range for both S-mode and A-mode incidence of the Lamb wave. We further attempt to develop an additional model that can suppress unwanted backward propagation due to a large mismatch at the heterojunction interface.
KW - Lamb wave
KW - finite-element simulation
KW - non-reciprocal acoustics
KW - phononic crystal
UR - http://www.scopus.com/inward/record.url?scp=85060614601&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85060614601&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2018.8579922
DO - 10.1109/ULTSYM.2018.8579922
M3 - Conference contribution
AN - SCOPUS:85060614601
T3 - IEEE International Ultrasonics Symposium, IUS
BT - 2018 IEEE International Ultrasonics Symposium, IUS 2018
PB - IEEE Computer Society
T2 - 2018 IEEE International Ultrasonics Symposium, IUS 2018
Y2 - 22 October 2018 through 25 October 2018
ER -