TY - GEN
T1 - Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication
AU - Ishimura, Kenta
AU - Toyota, Yoshitaka
AU - Iokibe, Kengo
AU - Kondo, Koichi
AU - Yoshida, Shigeyoshi
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Noise suppression and power integrity are two requirements for power/ground layers of printed circuit boards. To accomplish the requirements, we proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. To evaluate the proposed EBG structure, we have so far measured the electric characteristics of both driving-point impedance and transmission coefficient. Although these evaluation indices are helpful, the evaluation using an actual device is also indispensable. In this paper, we evaluated the suppression of noise propagation through power bus by the proposed EBG structure in wireless communication module. The proposed structure provided sufficient result of the effective maintenance of communication quality by suppressing the propagation of electromagnetic noise.
AB - Noise suppression and power integrity are two requirements for power/ground layers of printed circuit boards. To accomplish the requirements, we proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. To evaluate the proposed EBG structure, we have so far measured the electric characteristics of both driving-point impedance and transmission coefficient. Although these evaluation indices are helpful, the evaluation using an actual device is also indispensable. In this paper, we evaluated the suppression of noise propagation through power bus by the proposed EBG structure in wireless communication module. The proposed structure provided sufficient result of the effective maintenance of communication quality by suppressing the propagation of electromagnetic noise.
KW - actual device
KW - electromagnetic bandgap (EBG)
KW - ferrite film
KW - noise suppression
KW - performance maintenance
KW - wireless communication
UR - http://www.scopus.com/inward/record.url?scp=84894150197&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894150197&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2013.6724428
DO - 10.1109/EDAPS.2013.6724428
M3 - Conference contribution
AN - SCOPUS:84894150197
SN - 9781479923113
T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
SP - 217
EP - 220
BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Y2 - 12 December 2013 through 15 December 2013
ER -