TY - JOUR
T1 - Effect of low-shrinking composite on the bonding effectiveness of two adhesives in occlusal Class-I cavities
AU - Mine, Atsushi
AU - De Munck, Jan
AU - Cardoso, Marcio V.
AU - Van Landuyt, Kirsten L.
AU - Poitevin, André
AU - Kuboki, Takuo
AU - Yoshida, Yasuhiro
AU - Suzuki, Kazuomi
AU - Van Meerbeek, Bart
PY - 2012
Y1 - 2012
N2 - The purpose of this study was to evaluate if a low-shrinking composite can improve the bonding effectiveness of adhesives in highly constrained conditions. A low-shrinking composite ('els-extra low shrinkage', Saremco) was bonded in standardized occlusal Class-I cavities using a three-step ('cmf', Saremco) and a two-step etch-and-rinse adhesive ('XP Bond', Dentsply). Both adhesives were also combined with a conventional composite ('Z100', 3M ESPE). Half of the restored cavities were exposed to 20,000 thermo-cycles. 3-way ANOVA revealed a significant effect for the factors 'adhesive' and 'composite' (both p<0.0001), but not for 'thermo-cycling' (p=0.994). Significantly higher bond strengths were recorded for the low-shrinking composite than for the control composite, using either of the adhesives. The low-shrinking composite in combination with the three-step etch-and-rinse adhesive performed best in the high C-factor Class-I cavity. The two-step etch-and-rinse adhesive suffered strongly from polymerization-shrinkage stress, which could be partially restored by using the low-shrinking composite.
AB - The purpose of this study was to evaluate if a low-shrinking composite can improve the bonding effectiveness of adhesives in highly constrained conditions. A low-shrinking composite ('els-extra low shrinkage', Saremco) was bonded in standardized occlusal Class-I cavities using a three-step ('cmf', Saremco) and a two-step etch-and-rinse adhesive ('XP Bond', Dentsply). Both adhesives were also combined with a conventional composite ('Z100', 3M ESPE). Half of the restored cavities were exposed to 20,000 thermo-cycles. 3-way ANOVA revealed a significant effect for the factors 'adhesive' and 'composite' (both p<0.0001), but not for 'thermo-cycling' (p=0.994). Significantly higher bond strengths were recorded for the low-shrinking composite than for the control composite, using either of the adhesives. The low-shrinking composite in combination with the three-step etch-and-rinse adhesive performed best in the high C-factor Class-I cavity. The two-step etch-and-rinse adhesive suffered strongly from polymerization-shrinkage stress, which could be partially restored by using the low-shrinking composite.
KW - Bond strength
KW - Class-I cavity
KW - Etch and rinse
KW - Low-shrinking composite
KW - Thermo-cycling
UR - http://www.scopus.com/inward/record.url?scp=84861908466&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84861908466&partnerID=8YFLogxK
U2 - 10.4012/dmj.2011-261
DO - 10.4012/dmj.2011-261
M3 - Article
C2 - 22673473
AN - SCOPUS:84861908466
SN - 0287-4547
VL - 31
SP - 418
EP - 426
JO - Dental materials journal
JF - Dental materials journal
IS - 3
ER -