TY - GEN
T1 - Evaluation of impact of parasitic magnetic coupling in PCB layout on common source inductance of surface mounted package
AU - Matsumoto, Ryunosuke
AU - Aikawa, Kyota
AU - Konishi, Akihiro
AU - Umetami, Kazuhiro
AU - Hiraki, Eiji
N1 - Funding Information:
This study was supported by IEEJ International Conference Travel Grant.
Publisher Copyright:
© 2017 IEEE.
PY - 2018/2/9
Y1 - 2018/2/9
N2 - Recently, the common source inductance (CSI) is regarded as one of the most important obstacles for achieving ultrafast switching of switching converters. The CSI is pointed out to be a major cause of deterioration of the switching speed and false triggering. Therefore, many design instructions of next generation switching devices, such as GaN-FETs and SiC-MOSFETs, have pointed out the necessity to reduce the CSI. Certainly, many of the next generation switching devices are provided in surface mount packages in order to enable PCB designers to minimize the CSI by eliminating the common source path. However, the parasitic magnetic coupling between the gating circuit and the power circuit may still add the CSI, although preceding studies have scarcely reported how greatly the PCB layout can affect the CSI and the switching waveforms. This paper experimentally evaluated the impact of the parasitic magnetic coupling of the PCB layout on the CSI of the surface mount package and on the switching waveforms. As a result, the parasitic magnetic coupling was found to cause the major difference in the CSI. In addition, large difference in the turn-off switching waveforms was found to be caused by the difference in the magnetic coupling. The reason is also analyzed and discussed in this paper, suggesting importance of appropriate design of the parasitic magnetic coupling in the PCB layout.
AB - Recently, the common source inductance (CSI) is regarded as one of the most important obstacles for achieving ultrafast switching of switching converters. The CSI is pointed out to be a major cause of deterioration of the switching speed and false triggering. Therefore, many design instructions of next generation switching devices, such as GaN-FETs and SiC-MOSFETs, have pointed out the necessity to reduce the CSI. Certainly, many of the next generation switching devices are provided in surface mount packages in order to enable PCB designers to minimize the CSI by eliminating the common source path. However, the parasitic magnetic coupling between the gating circuit and the power circuit may still add the CSI, although preceding studies have scarcely reported how greatly the PCB layout can affect the CSI and the switching waveforms. This paper experimentally evaluated the impact of the parasitic magnetic coupling of the PCB layout on the CSI of the surface mount package and on the switching waveforms. As a result, the parasitic magnetic coupling was found to cause the major difference in the CSI. In addition, large difference in the turn-off switching waveforms was found to be caused by the difference in the magnetic coupling. The reason is also analyzed and discussed in this paper, suggesting importance of appropriate design of the parasitic magnetic coupling in the PCB layout.
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U2 - 10.1109/PEDS.2017.8289182
DO - 10.1109/PEDS.2017.8289182
M3 - Conference contribution
AN - SCOPUS:85045257725
T3 - Proceedings of the International Conference on Power Electronics and Drive Systems
SP - 559
EP - 566
BT - 2017 IEEE 12th International Conference on Power Electronics and Drive Systems, PEDS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2017
Y2 - 12 December 2017 through 15 December 2017
ER -