TY - GEN
T1 - Ferrite-covered open stub as lossy resonator filter for suppressing noise propagation in power bus
AU - Toyota, Yoshitaka
AU - Iokibe, Kengo
AU - Kondo, Koichi
AU - Yoshida, Shigeyoshi
PY - 2014/10/20
Y1 - 2014/10/20
N2 - A lossy resonator filter with frequency selectivity and low loss, which suppresses noise propagation in the power-ground plane pair of a printed circuit board (PCB) at high frequencies (over 1 GHz), was fabricated and evaluated. A ferrite-covered open stub was formed on a PCB as a lossy resonator filter, and its characteristics were verified by measurement using a vector network analyzer as well as full-wave simulation. The measurement and simulation results show that the noise in the power bus of the PCB at frequencies over 1 GHz is suppressed. Even in the case that the power bus is inside the board, noise propagation in the power bus was suppressed by connecting the inside ground plane and the ground plane of the lossy resonator filter by vias in order to conduct the noise to the filter.
AB - A lossy resonator filter with frequency selectivity and low loss, which suppresses noise propagation in the power-ground plane pair of a printed circuit board (PCB) at high frequencies (over 1 GHz), was fabricated and evaluated. A ferrite-covered open stub was formed on a PCB as a lossy resonator filter, and its characteristics were verified by measurement using a vector network analyzer as well as full-wave simulation. The measurement and simulation results show that the noise in the power bus of the PCB at frequencies over 1 GHz is suppressed. Even in the case that the power bus is inside the board, noise propagation in the power bus was suppressed by connecting the inside ground plane and the ground plane of the lossy resonator filter by vias in order to conduct the noise to the filter.
KW - ferrite thin film
KW - lossy resonator filter
KW - noise mitigation
KW - open stub
KW - printed circuit board
UR - http://www.scopus.com/inward/record.url?scp=84908688963&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908688963&partnerID=8YFLogxK
U2 - 10.1109/EMCEurope.2014.6931007
DO - 10.1109/EMCEurope.2014.6931007
M3 - Conference contribution
AN - SCOPUS:84908688963
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 765
EP - 769
BT - IEEE International Symposium on Electromagnetic Compatibility
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 International Symposium on Electromagnetic Compatibility, EMC Europe 2014
Y2 - 1 September 2014 through 4 September 2014
ER -