Abstract
A chemical vapor deposition (CVD) method, called ionization CVD, in which ionized source molecules were deposited on a substrate by Coulombic force, was developed to control gas-phase reaction and film morphology. This method was applied to the tetraethylorthosilicate (TEOS)/ ozone-atmospheric pressure chemical vapor deposition process by using the surface corona discharge. TEOS/O3 films deposited on SiN and SiO2 films by this CVD method showed good properties for the flow shape, the gap filling and the surface morphology. In Fourier-transform infrared spectra of gas-phase intermediates collected in the vapor condenser, the intensity of the absorption peak at 600 cm-1 was different between ionized intermediates and nonionized intermediates.
Original language | English |
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Pages (from-to) | 1973-1975 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 75 |
Issue number | 13 |
DOIs | |
Publication status | Published - Sept 27 1999 |
Externally published | Yes |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)