High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

Hibiki Yamamoto; Yasuhiro Okamoto; Muhamad Fahmi Bin Mohd Noor; Ryoji Kitada; Akira Okada

High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

Hibiki Yamamoto, Yasuhiro Okamoto, Muhamad Fahmi Bin Mohd Noor, Ryoji Kitada, Akira Okada

Research output: Contribution to conference › Paper › peer-review

Abstract

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

Original language	English
Publication status	Published - Dec 1 2011
Event	6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011 - Omiya Sonic City, Saitama, Japan Duration: Nov 8 2011 → Nov 10 2011

Other

Other	6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011
Country/Territory	Japan
City	Omiya Sonic City, Saitama
Period	11/8/11 → 11/10/11

Keywords

Fiber laser
Laser dicing
Semiconductor package
SHG:YAG laser
Superposition

ASJC Scopus subject areas

Industrial and Manufacturing Engineering

Cite this

High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser. / Yamamoto, Hibiki; Okamoto, Yasuhiro; Bin Mohd Noor, Muhamad Fahmi et al.
2011. Paper presented at 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011, Omiya Sonic City, Saitama, Japan.

Research output: Contribution to conference › Paper › peer-review

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title = "High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser",

abstract = "The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.",

keywords = "Fiber laser, Laser dicing, Semiconductor package, SHG:YAG laser, Superposition",

author = "Hibiki Yamamoto and Yasuhiro Okamoto and {Bin Mohd Noor}, {Muhamad Fahmi} and Ryoji Kitada and Akira Okada",

year = "2011",

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language = "English",

note = "6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011 ; Conference date: 08-11-2011 Through 10-11-2011",

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T1 - High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

AU - Yamamoto, Hibiki

AU - Okamoto, Yasuhiro

AU - Bin Mohd Noor, Muhamad Fahmi

AU - Kitada, Ryoji

AU - Okada, Akira

PY - 2011/12/1

Y1 - 2011/12/1

N2 - The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

AB - The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

KW - Fiber laser

KW - Laser dicing

KW - Semiconductor package

KW - SHG:YAG laser

KW - Superposition

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M3 - Paper

AN - SCOPUS:84883353668

T2 - 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011

Y2 - 8 November 2011 through 10 November 2011

ER -

High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

Abstract

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Keywords

ASJC Scopus subject areas

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