TY - GEN
T1 - Insertion of parallel RL circuits into power distribution network for simultaneous switching current reduction and power integrity
AU - Iokibe, Kengo
AU - Yano, Yusuke
AU - Toyota, Yoshitaka
PY - 2012/8/15
Y1 - 2012/8/15
N2 - We investigated a method using parallel RL circuits inserted into power distribution network (PDN) of integrated circuits (ICs) to enhance the IC in EMI and PI performance. Optimal damping resistances of the parallel RL circuit were derived from a characteristic equation of an equivalent circuit of a partial PDN that contributed to PDN resonances dominantly. The parallel RL circuit with the optimal resistances damps the PDN resonances as quickly as possible and reduces peaks in simultaneous switching current that will cause EMI and in input impedance of PDN related to PI. We validated the parallel RL circuit with respect to EMI and PI performance of ICs numerically and experimentally. Results of these validation showed that the proposed method descend the simultaneous switching current at both chip-package-board and on-board resonant frequency. It is also confirmed that insertion of the parallel RL circuits into the power trace reduced the impedance peak due to the chip-package-board resonance.
AB - We investigated a method using parallel RL circuits inserted into power distribution network (PDN) of integrated circuits (ICs) to enhance the IC in EMI and PI performance. Optimal damping resistances of the parallel RL circuit were derived from a characteristic equation of an equivalent circuit of a partial PDN that contributed to PDN resonances dominantly. The parallel RL circuit with the optimal resistances damps the PDN resonances as quickly as possible and reduces peaks in simultaneous switching current that will cause EMI and in input impedance of PDN related to PI. We validated the parallel RL circuit with respect to EMI and PI performance of ICs numerically and experimentally. Results of these validation showed that the proposed method descend the simultaneous switching current at both chip-package-board and on-board resonant frequency. It is also confirmed that insertion of the parallel RL circuits into the power trace reduced the impedance peak due to the chip-package-board resonance.
UR - http://www.scopus.com/inward/record.url?scp=84864858795&partnerID=8YFLogxK
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U2 - 10.1109/APEMC.2012.6237943
DO - 10.1109/APEMC.2012.6237943
M3 - Conference contribution
AN - SCOPUS:84864858795
SN - 9781457715587
T3 - cccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings
SP - 417
EP - 420
BT - 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings
T2 - 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012
Y2 - 21 May 2012 through 24 May 2012
ER -