Abstract
The ultrafast laser ablation of silicon has been investigated experimentally and theoretically. The theoretical description is based on molecular dynamics (MD) simulations combined with a microscopic electronic model. We determine the thresholds of melting and ablation for two different pulse durations τ = 20 and 500 fs. Experiments have been performed using 100 Ti:Sap-phire laser pulses per spot in air environment. The ablation thresholds were determined for pulses with a duration of 25 and 400fs, respectively. Good agreement is obtained between theory and experiment.
Original language | English |
---|---|
Pages (from-to) | 839-844 |
Number of pages | 6 |
Journal | Applied Surface Science |
Volume | 197-198 |
DOIs | |
Publication status | Published - Jan 1 2002 |
Externally published | Yes |
Event | Cola 2001 - Tsukuba, Japan Duration: Oct 1 2001 → Oct 1 2001 |
Keywords
- Laser ablation
- Pulse duration
- Threshold of silicon
ASJC Scopus subject areas
- Chemistry(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films