Low-Frequency Eddy Current Imaging Using MR Sensor Detecting Tangential Magnetic Field Components for Nondestructive Evaluation

K. Tsukada; T. Kiwa; T. Kawata; Y. Ishihara

doi:10.1109/TMAG.2006.879754

Low-Frequency Eddy Current Imaging Using MR Sensor Detecting Tangential Magnetic Field Components for Nondestructive Evaluation

K. Tsukada, T. Kiwa, T. Kawata, Y. Ishihara

Research output: Contribution to journal › Article › peer-review

50 Citations (Scopus)

Abstract

Not Available

Original language	English
Pages (from-to)	3315-3317
Journal	IEEE Transactions on Magnetics
Volume	42
Issue number	10
DOIs	https://doi.org/10.1109/TMAG.2006.879754
Publication status	Published - Oct 1 2006

Access to Document

10.1109/TMAG.2006.879754

http://adsabs.harvard.edu/abs/2006ITM....42.3315T

Cite this

@article{6e9710bddf0d4d21a6e4fbe3c7baaef3,

title = "Low-Frequency Eddy Current Imaging Using MR Sensor Detecting Tangential Magnetic Field Components for Nondestructive Evaluation",

abstract = "Not Available",

author = "K. Tsukada and T. Kiwa and T. Kawata and Y. Ishihara",

year = "2006",

month = oct,

day = "1",

doi = "10.1109/TMAG.2006.879754",

language = "English",

volume = "42",

pages = "3315--3317",

journal = "IEEE Transactions on Magnetics",

issn = "0018-9464",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "10",

}

TY - JOUR

T1 - Low-Frequency Eddy Current Imaging Using MR Sensor Detecting Tangential Magnetic Field Components for Nondestructive Evaluation

AU - Tsukada, K.

AU - Kiwa, T.

AU - Kawata, T.

AU - Ishihara, Y.

PY - 2006/10/1

Y1 - 2006/10/1

N2 - Not Available

AB - Not Available

U2 - 10.1109/TMAG.2006.879754

DO - 10.1109/TMAG.2006.879754

M3 - Article

SN - 0018-9464

VL - 42

SP - 3315

EP - 3317

JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

IS - 10

ER -

Low-Frequency Eddy Current Imaging Using MR Sensor Detecting Tangential Magnetic Field Components for Nondestructive Evaluation

Abstract

Access to Document

Fingerprint

Cite this