Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers

Yasuyuki Kusaka, Atsushi Takei, Tomonori Fukasawa, Toru Ishigami, Nobuko Fukuda

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


Thin-film layers of nanoparticles exhibit mechanical fragility that depends on their interactions. Balancing the cohesive force of particles with their interfacial adhesion to a substrate enables the selective transfer of micrometer-scale layer features. Here, the versatility of this adhesion-based transfer approach from poly(dimethylsiloxane) (PDMS) is presented by demonstrating micropatterns of various functional nanoparticulate materials, including Ag, Cu, indium tin oxide, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, and dielectric silica. With the attachment of the Johnson-Kendall-Roberts interaction to a simple strain model of particle layers during the patterning process, the patterning criteria for successful printing at both macroscale and nanoscale levels are deduced. Discrete element modeling analysis was used to validate the scaling laws and to highlight the fracture modes of particle layers during the patterning process. In particular, the balance among cohesive forces in the tensile direction and in the shear direction and the adhesion force at the layer-PDMS interface mainly regulates the patterning quality of adhesion patterning.

Original languageEnglish
Pages (from-to)40602-40612
Number of pages11
JournalACS Applied Materials and Interfaces
Issue number43
Publication statusPublished - Oct 30 2019
Externally publishedYes


  • adhesion
  • fracture
  • patterning
  • printing
  • strain

ASJC Scopus subject areas

  • Materials Science(all)


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