Abstract
In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
Original language | English |
---|---|
Title of host publication | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 229-232 |
Number of pages | 4 |
ISBN (Print) | 9781467383561 |
DOIs | |
Publication status | Published - Dec 23 2015 |
Event | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China Duration: Oct 21 2015 → Oct 23 2015 |
Other
Other | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 |
---|---|
Country/Territory | Taiwan, Province of China |
City | Taipei |
Period | 10/21/15 → 10/23/15 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering