Multi-layer coupled band-pass filter for 60 GHz LTCC system-on-package

Ken Hiraga, Tomohiro Seki, Kenjiro Nishikawa, Kazuhiro Uehara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)


We have developed a design method for space-saving and wide passband band-pass filter (BPF) for 60-GHz band applications. The BPF comprises multilayer-coupled stripline resonators on a multilayer low temperature co-fired ceramic (LTCC) substrate and can be highly integrated into a millimeter-wave system-on-package that is suitable for 60 GHz-band wireless communication applications. The proposed design method provides compactness and wide passband characteristics under fabrication accuracy limitation. The prototype filter is fabricated on a six-layer 50-m LTCC substrate. A fabricated prototype BPF circuit achieves a passband of 5466 GHz, which is suitable for 60 GHz channels. We also clarified that the displacements between layers of the LTCC multilayer substrate caused during its fabrication degraded its characteristics only slightly.

Original languageEnglish
Title of host publication2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010
Number of pages4
Publication statusPublished - 2010
Externally publishedYes
Event2010 Asia-Pacific Microwave Conference, APMC 2010 - Yokohama, Japan
Duration: Dec 7 2010Dec 10 2010

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC


Other2010 Asia-Pacific Microwave Conference, APMC 2010


  • LTCC
  • band-pass filter
  • millimeter-wave
  • multilayer
  • system-on-package

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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