Optical transmission between III-V chips on si using photonic wire bonding

Zhichen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Takuo Hiratani, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


Photonic wire bonding (PWB) was used to achieve flexible chipscale optical interconnection as a kind of 3D-freeform polymer waveguide based on the two-photon polymerization of SU-8. First, the fabrication conditions of PWB were determined for the two-photon absorption process, and the coupling structure between PWB and III-V optical components was numerically simulated in order to obtain high coupling efficiency. Then, using PWB, chip-to-chip optical transmission was realized between laser and detector chips located on a common Si substrate. We fabricated a 2.5-μm-wide PWB with 1:3 aspect ratio between two optical chips of 140-μm gap and achieved a connection loss of approximately 10 dB.

Original languageEnglish
Pages (from-to)22394-22403
Number of pages10
JournalOptics Express
Issue number17
Publication statusPublished - Aug 24 2015

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics


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