TY - GEN
T1 - Prediction of electromagnetic emissions from PCBs with interconnections through common-mode antenna model
AU - Toyota, Yoshitaka
AU - Sadatoshi, Akifumi
AU - Watanabe, Tetsushi
AU - Iokibe, Kengo
AU - Koga, Ryuji
AU - Wada, Osami
PY - 2007/12/1
Y1 - 2007/12/1
N2 - A motherboard-daughterboard structure with a connector is known to have another source of common-mode radiated emissions, and the emissions depend on the connector's signal/ground pin configuration. In order to estimate the amount of radiated emissions from the structure, a commonmode antenna model is described. The model consists of an excitation source and an antenna element, and it calculates radiated emissions from PCBs not only quickly but accurately for practical use. In modeling the board interconnection via a connector, we added two common-mode excitation sources at each end of the connector. The electromagnetic emissions estimated by the model agreed with the measurements within an error of 6 dB around peak emission levels between 300 and 600 MHz.
AB - A motherboard-daughterboard structure with a connector is known to have another source of common-mode radiated emissions, and the emissions depend on the connector's signal/ground pin configuration. In order to estimate the amount of radiated emissions from the structure, a commonmode antenna model is described. The model consists of an excitation source and an antenna element, and it calculates radiated emissions from PCBs not only quickly but accurately for practical use. In modeling the board interconnection via a connector, we added two common-mode excitation sources at each end of the connector. The electromagnetic emissions estimated by the model agreed with the measurements within an error of 6 dB around peak emission levels between 300 and 600 MHz.
UR - http://www.scopus.com/inward/record.url?scp=47149096562&partnerID=8YFLogxK
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U2 - 10.1109/EMCZUR.2007.4388207
DO - 10.1109/EMCZUR.2007.4388207
M3 - Conference contribution
AN - SCOPUS:47149096562
SN - 9783952328606
T3 - Proceedings of the 18th International Zurich Symposium on Electromagnetic Compatibility, EMC
SP - 107
EP - 110
BT - Proceedings of the 18th International Zurich Symposium on Electromagnetic Compatibility, EMC
T2 - 18th International Zurich Symposium on Electromagnetic Compatibility, EMC
Y2 - 24 September 2007 through 28 September 2007
ER -