TY - GEN
T1 - Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet
AU - Tada, Naoya
AU - Masago, Hiroyasu
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.
AB - Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.
UR - http://www.scopus.com/inward/record.url?scp=84893903241&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893903241&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2013.6706624
DO - 10.1109/IMPACT.2013.6706624
M3 - Conference contribution
AN - SCOPUS:84893903241
SN - 9781479906673
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 186
EP - 189
BT - 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud
T2 - 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013
Y2 - 22 October 2013 through 25 October 2013
ER -