Temperature control and packaging optimization of the integrated hydrogen sensor

Kousuke Tsubota, Toshihiko Kiwa, Hironobu Yamada, Tomiharu Yamaguchi, Yohei Kondo, Hirofumi Imajo, Tsutomu Hondo, Tunetoshi Maehara, Tadayoshi Yamamoto, Keiji Tsukada

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


An integrated sensor chip combining a heater for temperature control and a diode for temperature monitoring was fabricated and its characteristics evaluated. Furthermore, a new packaging structure with a gas permeable film and sensor chip attached to the glass to improve the heat efficiency were developed. Using this packaging structure, the optimum working conditions and protection for the sensor chip were realized. The features of the diode were suffïcient to verify the sensor temperature. In terms of the value of heat efficiency per power consumption, we succeeded in advancing its values by about 15% compared to the glassless type. Furthermore, the time response curves for the sensor temperature and power consumption of the heater were measured. The thermal control System consists of a heater and the diode was successfully utilized to maintain the intended temperature. The heat efficiency was improved by attaching a glass and this System was found to be useful for the PPG-FET type hydrogen sensor.

Original languageEnglish
Pages (from-to)278-282+2
JournalIEEJ Transactions on Sensors and Micromachines
Issue number9
Publication statusPublished - 2009


  • Diode
  • Heat efficiency
  • Heater
  • Integrated sensor chip
  • Packaging

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


Dive into the research topics of 'Temperature control and packaging optimization of the integrated hydrogen sensor'. Together they form a unique fingerprint.

Cite this