TY - GEN
T1 - Tensile test of small lead-free solder joint using permanent magnet
AU - Tada, Naoya
AU - Nishihara, Ryo
AU - Masago, Hiroyasu
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Since solder materials are often used for electric connections in various electric devices, the strength of solders and that of interfaces to the other metallic materials are very important. After the restriction of lead solder usage according to the European Union Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) Directives, various lead-free solders have been developed and their optimized joining condition is being investigated. The mechanical test of solder joints is one of the best ways to check the joining condition and it gives us useful information to secure the safety of electric devices. From the viewpoint of mechanical testing, it is not easy to handle the solder materials because of their very low deformation resistance and small size. In this paper, a new method of tensile test is proposed using permanent magnet, and the results are discussed. By using the permanent magnet, various non-contact tensile tests are going to be possible. The present paper is a basic study to realize the non-contact tensile tests for micro materials.
AB - Since solder materials are often used for electric connections in various electric devices, the strength of solders and that of interfaces to the other metallic materials are very important. After the restriction of lead solder usage according to the European Union Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) Directives, various lead-free solders have been developed and their optimized joining condition is being investigated. The mechanical test of solder joints is one of the best ways to check the joining condition and it gives us useful information to secure the safety of electric devices. From the viewpoint of mechanical testing, it is not easy to handle the solder materials because of their very low deformation resistance and small size. In this paper, a new method of tensile test is proposed using permanent magnet, and the results are discussed. By using the permanent magnet, various non-contact tensile tests are going to be possible. The present paper is a basic study to realize the non-contact tensile tests for micro materials.
UR - http://www.scopus.com/inward/record.url?scp=84874258210&partnerID=8YFLogxK
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U2 - 10.1109/IMPACT.2012.6420226
DO - 10.1109/IMPACT.2012.6420226
M3 - Conference contribution
AN - SCOPUS:84874258210
SN - 9781467316385
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 145
EP - 148
BT - 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
T2 - 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
Y2 - 24 October 2012 through 26 October 2012
ER -