Abstract
Solder joints have been used for electric connections in many electronic devices, and the joints are subjected to mechanical loadings such as static or cyclic tension/compression and shearing under various environments. Since the melting point of solder is very low comparing with the other normal metals, the time-dependent damage accumulation and fracture are often found in the solders even at the room temperature. In this paper, tensile tests of copper-cored lead-free solder ball and nickel rod joints were carried out in air, distilled water, and salt water environments using a unique testing device with permanent magnet. The time-dependent fracture of the joints was investigated from the viewpoint of damage accumulation.
| Original language | English |
|---|---|
| Title of host publication | IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings |
| Publisher | IEEE Computer Society |
| Pages | 168-171 |
| Number of pages | 4 |
| Volume | 2017-October |
| ISBN (Electronic) | 9781538647196 |
| DOIs | |
| Publication status | Published - Jan 12 2018 |
| Event | 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan, Province of China Duration: Oct 25 2017 → Oct 27 2017 |
Other
| Other | 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 |
|---|---|
| Country/Territory | Taiwan, Province of China |
| City | Taipei |
| Period | 10/25/17 → 10/27/17 |
ASJC Scopus subject areas
- Hardware and Architecture
- Control and Systems Engineering
- Electrical and Electronic Engineering