Abstract
This paper presents an image analysis for detection of defects at BGA. We attempt to detect the characteristics of the defects at BGA based on an image analysis. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. Besides, in order to get information in detail of an abnormal BGA, we tried to capture the tomographic images utilizing the latest imaging techniques. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on the X-ray image data.
| Original language | English |
|---|---|
| Pages | 3329-3334 |
| Number of pages | 6 |
| Publication status | Published - Dec 1 2005 |
| Event | SICE Annual Conference 2005 - Okayama, Japan Duration: Aug 8 2005 → Aug 10 2005 |
Other
| Other | SICE Annual Conference 2005 |
|---|---|
| Country/Territory | Japan |
| City | Okayama |
| Period | 8/8/05 → 8/10/05 |
Keywords
- Ball Grid Array
- Image analysis
- Tomography
- X-ray
ASJC Scopus subject areas
- Control and Systems Engineering
- Computer Science Applications
- Electrical and Electronic Engineering