Tomographic image analysis for detection of defects at BGA

T. Sumimoto, Toshinori Maruyama, Yoshiharu Azuma, S. Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Contribution to conferencePaperpeer-review


This paper presents an image analysis for detection of defects at BGA. We attempt to detect the characteristics of the defects at BGA based on an image analysis. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. Besides, in order to get information in detail of an abnormal BGA, we tried to capture the tomographic images utilizing the latest imaging techniques. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on the X-ray image data.

Original languageEnglish
Number of pages6
Publication statusPublished - Dec 1 2005
EventSICE Annual Conference 2005 - Okayama, Japan
Duration: Aug 8 2005Aug 10 2005


OtherSICE Annual Conference 2005


  • Ball Grid Array
  • Image analysis
  • Tomography
  • X-ray

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Computer Science Applications
  • Electrical and Electronic Engineering


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