Unusual Elastic and Mechanical Behaviors of Copper Phosphate Glasses with Different Copper Valence States

Tadashi Miura, Toshio Watanabe, Yasuhiko Benino, Takayuki Komatsu, Ryuji Sato

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)


Elastic and mechanical properties such as Young's modulus E, Poisson's ratio v, Debye temperature θD, Vickers hardness Hv, fracture toughness Kc, and fracture surface energies γf of yCuOx ·(100-y)P2O5 glasses (y = 45, 50, 55) with different copper valence states, i.e., R(Cu+) = Cu+/(Cu+ + Cu2+), at room temperature (humidity 64%) have been examined. The following features have been found: (1) the glass transition temperature (218-434°C), Hv (2.7-4.4 GPa), E (50.6-78.2 GPa), and θD (358-434 K) decrease largely with increasing R(Cu+); (2) the mean atomic volume, Kc (0.56-1.14 MPa·m1/2), and γf (1.9-11.2 J·m-2) tend to increase with increasing R(Cu+); (3) 50CuOx·502PO5 glasses with R(Cu+) = 0.42 and 0.55 have a high resistance against crack formation in Vickers indentation tests and no crack is observed in the 45CuOx·55P2O5 glass with R(Cu+) = 0.57 under an applied load of about 98 N. The results demonstrate that elastic and mechanical properties of yCuOx·(100-y)P2O5 glasses depend strongly on the copper valence state and the CuOx/P2O5 ratio. The unusal mechanical and elastic properties of copper phosphate glasses are well explained qualitatively by considering unique oxygen coordination and bonding states of Cu+ ions, i.e., lower coordination number and more covalent bonding compared with Cu2+ ions.

Original languageEnglish
Pages (from-to)2401-2408
Number of pages8
JournalJournal of the American Ceramic Society
Issue number10
Publication statusPublished - Oct 2001
Externally publishedYes

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry


Dive into the research topics of 'Unusual Elastic and Mechanical Behaviors of Copper Phosphate Glasses with Different Copper Valence States'. Together they form a unique fingerprint.

Cite this