Translated title of the contribution | Waveform and Spectrum Analysis for Board Design —Basics and Applications— |
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Original language | Japanese |
Pages (from-to) | 461-471 |
Number of pages | 11 |
Journal | Journal of Japan Institute of Electronics Packaging |
Volume | 25 |
Issue number | 5 |
DOIs | |
Publication status | Published - 2022 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering