Bonding effectiveness and interfacial characterization of a HEMA/TEGDMA-free three-step etch&rinse adhesive

Atsushi Mine, Jan De Munck, Kirsten L. Van Landuyt, André Poitevin, Takuo Kuboki, Yasuhiro Yoshida, Kazuomi Suzuki, Paul Lambrechts, Bart Van Meerbeek