TY - GEN
T1 - Contact angle of water droplet on deforming rubber sheet with micro surface structures
AU - Morishige, Yoshihisa
AU - Suzumori, Koichi
AU - Wakimoto, Shuichi
AU - Kanda, Takefumi
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/2/10
Y1 - 2016/2/10
N2 - Interfacial free energy of materials and micro structures on solid surface influence wetting behavior at solid-liquid interface. Controls of wettability by making micro structures on silicon surface have been approached. By reference to those approaches, the authors consider that deformation of micro surface structures changes wettability. In this report, we have made micro surface structures from silicone rubber, and have aimed to change wettability of a droplet by deforming micro structures. We prepared micropillar array on silicone rubber sheet. The diameter and the height of pillar were 200 p.m. The pitch of pillars extended as the rubber sheet extended, and contact angle of water droplet changed. The edge of water droplet jumped from exterior pillars to interior pillars a few times.
AB - Interfacial free energy of materials and micro structures on solid surface influence wetting behavior at solid-liquid interface. Controls of wettability by making micro structures on silicon surface have been approached. By reference to those approaches, the authors consider that deformation of micro surface structures changes wettability. In this report, we have made micro surface structures from silicone rubber, and have aimed to change wettability of a droplet by deforming micro structures. We prepared micropillar array on silicone rubber sheet. The diameter and the height of pillar were 200 p.m. The pitch of pillars extended as the rubber sheet extended, and contact angle of water droplet changed. The edge of water droplet jumped from exterior pillars to interior pillars a few times.
UR - https://www.scopus.com/pages/publications/84963784948
UR - https://www.scopus.com/pages/publications/84963784948#tab=citedBy
U2 - 10.1109/SII.2015.7405153
DO - 10.1109/SII.2015.7405153
M3 - Conference contribution
AN - SCOPUS:84963784948
T3 - 2015 IEEE/SICE International Symposium on System Integration, SII 2015
SP - 948
EP - 951
BT - 2015 IEEE/SICE International Symposium on System Integration, SII 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th Annual IEEE/SICE International Symposium on System Integration, SII 2015
Y2 - 11 December 2015 through 13 December 2015
ER -