Design methodology of tightly coupled asymmetrically tapered bend for high-density mounting in differential transmission lines

研究成果

8 被引用数 (Scopus)

抄録

The bend in a pair of differential transmission lines on printed circuit boards causes a path difference, which leads to mode conversion due to the phase difference. We previously proposed a tightly coupled asymmetrically tapered bend to suppress forward differential-to-common mode conversion. In this paper, we propose a design methodology of our tightly coupled asymmetrically tapered bend that limits the bend structure within the area of the original classic bend for high-density mounting. We also evaluated the 45-degree-angle bend formed based on our design methodology and found that the methodology helps improve or maintain its transmission characteristics compared to those of the classic bend.

本文言語English
ホスト出版物のタイトル2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ページ463-465
ページ数3
ISBN(電子版)9781467394949
DOI
出版ステータスPublished - 7月 26 2016
イベント7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 - Shenzhen
継続期間: 5月 17 20165月 21 2016

Other

Other7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
国/地域China
CityShenzhen
Period5/17/165/21/16

ASJC Scopus subject areas

  • 放射線
  • コンピュータ ネットワークおよび通信
  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学
  • 器械工学

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