TY - GEN
T1 - Effect of nanoscale structure on thermal contact resistance of carbon nanotubes
AU - Yamada, Yutaka
AU - Nishiyama, Takashi
AU - Ikuta, Tatsuya
AU - Takahashi, Koji
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Carbon nanotube is a promising material for thermal-management of micro devices because of its high intrinsic thermal conductivity. However, most bulk nanotubes show very low thermal conductivity due to the high thermal contact resistance. There are very few reliable experimental data for the contact issue of nanotubes. This paper uses three kinds of multi-walled carbon nanotubes; pristine, thermally-oxidized, and acidized nanotube. Each has unique nanoscale structure in their outermost surface. We measured thermal conductivity of their pellets and simultaneously conducted computational analysis treating random network model of spherocylinders. By comparing both results, thermal contact resistances between nanotubes are estimated and the effect of defected structure is discussed. The reliability of our method is also successfully confirmed compared with reported data using individual nanotubes.
AB - Carbon nanotube is a promising material for thermal-management of micro devices because of its high intrinsic thermal conductivity. However, most bulk nanotubes show very low thermal conductivity due to the high thermal contact resistance. There are very few reliable experimental data for the contact issue of nanotubes. This paper uses three kinds of multi-walled carbon nanotubes; pristine, thermally-oxidized, and acidized nanotube. Each has unique nanoscale structure in their outermost surface. We measured thermal conductivity of their pellets and simultaneously conducted computational analysis treating random network model of spherocylinders. By comparing both results, thermal contact resistances between nanotubes are estimated and the effect of defected structure is discussed. The reliability of our method is also successfully confirmed compared with reported data using individual nanotubes.
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U2 - 10.1115/HT2012-58203
DO - 10.1115/HT2012-58203
M3 - Conference contribution
AN - SCOPUS:84892659417
SN - 9780791844779
T3 - ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
SP - 173
EP - 177
BT - ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
T2 - ASME 2012 Heat Transfer Summer Conference Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
Y2 - 8 July 2012 through 12 July 2012
ER -