TY - GEN
T1 - Electromagnetic immunity analysis using modal-equivalent circuit in cable interconnection system
AU - Toyota, Yoshitaka
AU - Iokibe, Kengo
AU - Koga, Liuji R.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/3
Y1 - 2015/8/3
N2 - Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.
AB - Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.
UR - http://www.scopus.com/inward/record.url?scp=84964033479&partnerID=8YFLogxK
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U2 - 10.1109/APEMC.2015.7175388
DO - 10.1109/APEMC.2015.7175388
M3 - Conference contribution
AN - SCOPUS:84964033479
T3 - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
SP - 716
EP - 719
BT - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
Y2 - 25 May 2015 through 29 May 2015
ER -