Free-Standing Metal Films Prepared via Electroless Plating at Liquid-Liquid Interfaces

Physics & Astronomy

• liquid-liquid interfaces 100%
• plating 80%
• palladium 78%
• metal films 75%
• copper 51%
• nanoparticles 49%
• affinity 40%
• preparation 26%
• stirring 21%
• microbalances 18%
• templates 16%
• catalysts 16%
• synthesis 13%
• electrical resistivity 11%
• heating 11%
• water 10%
• metals 9%
• energy 5%

Engineering & Materials Science

• Electroless plating 98%
• Palladium 54%
• Liquids 48%
• Metals 46%
• Nanoparticles 41%
• Copper 33%
• Organic solvents 29%
• Film preparation 19%
• Surface structure 12%
• Electric Conductivity 11%
• Catalysts 8%
• Heating 7%
• Water 5%

Chemical Compounds

• Liquid-Liquid Interface 92%
• Palladium Nanoparticle 42%
• Liquid Film 35%
• Metal 32%
• Organic Solvent 13%
• 1,2-dichloroethane 10%
• Surface Structure 8%
• Electrical Conductivity 7%
• Energy 4%
• Catalyst 3%