抄録
This paper describes a proposed planar electromagnetic bandgap (EBG) structure whose unit cell size is miniaturized through the use of interdigital electrodes (IDEs). For planar EBG structures in general, it is difficult to miniaturize the cell size independently of stopband frequency because the stopband frequency depends on the cell size. For the proposed structure, however, the cell size can be miniaturized because the IDEs help enlarge the capacitance between adjacent unit cells and utilize a resonator formed in the unit cells. Because the resonator's resonant frequency determines the stopband frequency of an EBG structure with IDEs, the cell size can be miniaturized independently of the stopband frequency. In the work described in this paper, the proposed EBG structure's efficacy in reducing power bus noise was examined and evaluated through full-wave simulation and measurement in the wireless communication band. It was found that an IDE-EBG structure with a small (25 mm2) unit cell is a valid means for achieving power bus noise reduction.
本文言語 | English |
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ホスト出版物のタイトル | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 39-42 |
ページ数 | 4 |
ISBN(印刷版) | 9781467380997 |
DOI | |
出版ステータス | Published - 1月 14 2016 |
イベント | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul 継続期間: 12月 14 2015 → 12月 16 2015 |
Other
Other | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 |
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国/地域 | Korea, Republic of |
City | Seoul |
Period | 12/14/15 → 12/16/15 |
ASJC Scopus subject areas
- 電子工学および電気工学
- 電子材料、光学材料、および磁性材料