Miniaturization of a planar EBG structure using interdigital electrodes

Yuki Yamashita, Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida, Toshiyuki Kaneko

研究成果

1 被引用数 (Scopus)

抄録

This paper describes a proposed planar electromagnetic bandgap (EBG) structure whose unit cell size is miniaturized through the use of interdigital electrodes (IDEs). For planar EBG structures in general, it is difficult to miniaturize the cell size independently of stopband frequency because the stopband frequency depends on the cell size. For the proposed structure, however, the cell size can be miniaturized because the IDEs help enlarge the capacitance between adjacent unit cells and utilize a resonator formed in the unit cells. Because the resonator's resonant frequency determines the stopband frequency of an EBG structure with IDEs, the cell size can be miniaturized independently of the stopband frequency. In the work described in this paper, the proposed EBG structure's efficacy in reducing power bus noise was examined and evaluated through full-wave simulation and measurement in the wireless communication band. It was found that an IDE-EBG structure with a small (25 mm2) unit cell is a valid means for achieving power bus noise reduction.

本文言語English
ホスト出版物のタイトル2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ39-42
ページ数4
ISBN(印刷版)9781467380997
DOI
出版ステータスPublished - 1月 14 2016
イベントIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul
継続期間: 12月 14 201512月 16 2015

Other

OtherIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
国/地域Korea, Republic of
CitySeoul
Period12/14/1512/16/15

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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