TY - GEN
T1 - New resist-coating technique using fine mist for three-dimensional nanotechnology
AU - Yamazaki, K.
AU - Namatsu, H.
PY - 2006/10/24
Y1 - 2006/10/24
N2 - We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO 2Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.
AB - We have devised a new resist-coating technique for three-dimensional (3D) substrates. The technique uses a quasi-static ambient of very fine mist and enables us to coat a resist film on a 3D substrate such as a cube. We found good conditions for obtaining a resist film with a uniform thickness and smooth surface and succeeded in coating polymethyl-methacrylate on a SiO 2Si cube. Moreover, electron-beam (EB) lithography on the cube resulted in similar patterns on each face of the top and side faces. This technique promises to enable 3D nanofabrication of various materials such as silicon with the resolution of EB lithography.
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M3 - Conference contribution
AN - SCOPUS:33750105019
SN - 0780394755
SN - 9780780394759
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 254
EP - 257
BT - 19th IEEE International Conference on Micro Electro Mechanical Systems
T2 - 19th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 22 January 2006 through 26 January 2006
ER -