TY - JOUR
T1 - Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards
AU - Toyota, Yoshitaka
AU - Engin, Arif Ege
AU - Kim, Tae Hong
AU - Swaminathan, Madhavan
PY - 2006/12
Y1 - 2006/12
N2 - Electromagnetic bandgap (EBG) structures that provide an excellent isolation within the stopband are extremely effective in suppressing propagation of simultaneous switching noise on parallel power planes. However, a scattering parameter measurement and full-wave electromagnetic simulation for their entire structure are costly and time consuming. This letter presents a two-dimensional dispersion-diagram analysis based on a unit-cell network of EBG structures by extending a well-known dispersion-diagram analysis of one-dimensional infinite periodic structures. The approach is extremely effective in computing stopband frequencies and provides the stopbands with good agreement to the measured results.
AB - Electromagnetic bandgap (EBG) structures that provide an excellent isolation within the stopband are extremely effective in suppressing propagation of simultaneous switching noise on parallel power planes. However, a scattering parameter measurement and full-wave electromagnetic simulation for their entire structure are costly and time consuming. This letter presents a two-dimensional dispersion-diagram analysis based on a unit-cell network of EBG structures by extending a well-known dispersion-diagram analysis of one-dimensional infinite periodic structures. The approach is extremely effective in computing stopband frequencies and provides the stopbands with good agreement to the measured results.
KW - Electromagnetic bandgap (EBG) structures
KW - Four-port network
KW - Parallel power planes
KW - Periodic structures
KW - Printed circuit boards (PCBs)
KW - Simultaneous switching noise (SSN)
KW - Two-dimensional (2-D) dispersion-diagram analysis
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U2 - 10.1109/LMWC.2006.885587
DO - 10.1109/LMWC.2006.885587
M3 - Article
AN - SCOPUS:33845524638
SN - 1531-1309
VL - 16
SP - 645
EP - 647
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 12
ER -