TY - JOUR
T1 - The silicon vertex detector of the Belle II experiment
AU - Belle II SVD collaboration
AU - Adamczyk, K.
AU - Aihara, H.
AU - Angelini, C.
AU - Aziz, T.
AU - Babu, V.
AU - Bacher, S.
AU - Bahinipati, S.
AU - Barberio, E.
AU - Baroncelli, T.
AU - Basith, A. K.
AU - Batignani, G.
AU - Bauer, A.
AU - Behera, P. K.
AU - Bergauer, T.
AU - Bettarini, S.
AU - Bhuyan, B.
AU - Bilka, T.
AU - Bosi, F.
AU - Bosisio, L.
AU - Bozek, A.
AU - Buchsteiner, F.
AU - Casarosa, G.
AU - Ceccanti, M.
AU - Červenkov, D.
AU - Chendvankar, S. R.
AU - Dash, N.
AU - Divekar, S. T.
AU - Doležal, Z.
AU - Dutta, D.
AU - Forti, F.
AU - Friedl, M.
AU - Hara, K.
AU - Higuchi, T.
AU - Horiguchi, T.
AU - Irmler, C.
AU - Ishikawa, A.
AU - Jeon, H. B.
AU - Joo, C. W.
AU - Kandra, J.
AU - Kang, K. H.
AU - Kato, E.
AU - Kawasaki, T.
AU - Kodyš, P.
AU - Kohriki, T.
AU - Koike, S.
AU - Kolwalkar, M. M.
AU - Kvasnička, P.
AU - Lanceri, L.
AU - Lettenbicher, J.
AU - Uozumi, S.
N1 - Funding Information:
The authors thank the support of this work by World Premier International Research Center Initiative (WPI) , MEXT, Japan; JSPS Grant-in-Aid for Young Scientists (B) (Grant no. 23740220 ); and JSPS Program for Advancing Strategic International Networks to Accelerate the Circulation of Talented Researchers.
Publisher Copyright:
© 2015 Elsevier B.V.
PY - 2016/7/11
Y1 - 2016/7/11
N2 - The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 μm. The potential functionality of the ladder is also demonstrated by the radioactive source test.
AB - The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 μm. The potential functionality of the ladder is also demonstrated by the radioactive source test.
KW - B Factory experiment
KW - Belle II
KW - Silicon vertex detector
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U2 - 10.1016/j.nima.2015.09.076
DO - 10.1016/j.nima.2015.09.076
M3 - Article
AN - SCOPUS:84951909379
SN - 0168-9002
VL - 824
SP - 406
EP - 410
JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
ER -