TY - GEN
T1 - Ultra compact RFICs using three-dimensional MMIC technology
AU - Kaho, Takana
AU - Yamaguchi, Yo
AU - Nishikawa, Kenjiro
AU - Toyoda, Ichihiko
AU - Uehara, Kazuhiro
PY - 2010/10/15
Y1 - 2010/10/15
N2 - Since the 1980s, NTT has been developing threedimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasimillimeter and millimeter wave levels. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
AB - Since the 1980s, NTT has been developing threedimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasimillimeter and millimeter wave levels. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
KW - Balun
KW - Directional coupler
KW - High Q inductor
KW - Stacked inductor
KW - Three-dimensional MMIC
KW - Transceiver
UR - http://www.scopus.com/inward/record.url?scp=77957757488&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77957757488&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2010.5517752
DO - 10.1109/MWSYM.2010.5517752
M3 - Conference contribution
AN - SCOPUS:77957757488
SN - 9781424477326
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 1304
EP - 1307
BT - 2010 IEEE MTT-S International Microwave Symposium, MTT 2010
T2 - 2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Y2 - 23 May 2010 through 28 May 2010
ER -